Allied Market Research published an exclusive report, titled, “Outsourced Semiconductor Assembly and Testing Market By Process (Sawing, Sorting, Testing, and Assembly), Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, and Quad & Dual), and Application (Consumer Electronics, Industrial, Telecommunication, Automotive, Aerospace & Defense, Medical & Healthcare, and Logistics & Transportation): Global Opportunity Analysis …