Semiconductor Packaging Market Expected to Reach $60.44 Billion by 2030

INTRODUCTION TO REPORT

The semiconductor packaging market is expected to leverage high potential for consumer electronics and automotive verticals. The current business scenario is witnessing an increasing demand for consumer electronics devices, particularly in developing countries such as China, Japan, South Korea, India, and others. Companies in this industry are adopting various innovative techniques, such as merger & acquisition activities, to strengthen their business position in the competitive matrix. 

According to a new report published by Allied Market Research, titled, “Semiconductor Packaging Market by Type, Packaging Material, Wafer Material, Technology, and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2021–2030” the global semiconductor packaging market size was valued at $27.10 billion in 2020 and is projected to reach $60.44 billion by 2030, registering a CAGR of 9.10% during the forecast period. Asia-Pacific is expected to be the leading contributor to the global market, followed by North America and Europe.   

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NEED FOR THE REPORT:

The current situation of pandemic makes it very important for the stakeholders in the Semiconductor Packaging Market size to understand the market deeply, which will help them in taking sound decisions to gain the competitive advantage. By exploring the unexplored areas of market, the key players can surely gain a larger market share.

KEY SEGMENTATION:

Segregating the large problem into smaller parts makes it easy to solve even the complex problems. Similarly, to analyze the Semiconductor Packaging Market effectively and efficiently, the market has been segmented into, type, applications, and region. The related graphs and data tables have made the analysis much impactful and easily understandable. The interested parties can surely rip the benefits of the report on the Semiconductor Packaging Market.

KEY MARKET PLAYERS:

The report offers a competitive analysis in the report, in which, the performance of the competitors in past, the revenue, and strategies framed are analyzed in detail. The key players in Semiconductor Packaging Market are Amkor Technology (U.S.), ASE Group (Taiwan), ChipMOS Technologies, Inc. (Taiwan), Powertech Technology, Inc. (Taiwan), Intel Corporation (U.S.), Jiangsu Changjiang Electronics Technology Co., LTD (China), Samsung Electronics Co., Ltd. (South Korea), Taiwan Semiconductor Manufacturing Company (Taiwan), Texas Instruments (U.S.), and Fujitsu Limited (Japan).

The competitors’ analysis will be helpful for new entrants to frame the profitable strategies that will help them gain the market share and achieve the objective of wealth maximization.

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KEY BENEFITS FOR STAKEHOLDERS

  • This study includes the Semiconductor Packaging Market analysis, trends, and future estimations to determine the imminent investment pockets.
  • The report presents information related to key drivers, restraints, and Semiconductor Packaging Market opportunity.
  • The market size is quantitatively analyzed from 2019 to 2030 to highlight the financial competency of the industry.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the Semiconductor Packaging Market.

Key Market Segments

By Type

  • Flip Chip
  • Embedded DIE
  • Fan-in WLP
  • Fan-out WLP

By Packaging Material

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Ceramic Package
  • Die Attach Material
  • Others

By Wafer Material

  • Simple  Semiconductor    
    • Silicon (Si)    
    • Germanium (Ge)    
  • Compound Semiconductor    
    • III-V    
      • Gallium Arsenide (GaAs)
      • Indium Phosphide (InP)
      • Gallium Nitride (GaN) 
      • Gallium phosphide (GaP)
      • Others
    • II-VI    
      • Zinc Sulfide (ZnS)
      • Zinc Selenide (ZnSe)
    • IV-IV    
      • Silicon Carbide (SiC)
      • Silicon-Germanium (SiGe)

By Technology

  • Grid Array    
  • Small Outline Package    
  • Flat no-leads packages    
    • Dual-flat no-leads (DFN) 
    • Quad-flat no-leads (QFN)
  • Dual In-Line Package    
    • Plastic Dual Inline Package (PDIP)
    • Ceramic Dual Inline Package (CDIP)
  • Others    

By End User

  • Consumer Electronics 
  • Automotive 
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others 

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany 
    • UK
    • France    
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China 
    • Japan
    • India
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East & Africa

ABOUT US

Allied Market Research (AMR) is a market research and business-consulting firm of Allied Analytics LLP, based in Portland, Oregon. AMR offers market research reports, business solutions, consulting services, and insights on markets across 11 industry verticals. Adopting extensive research methodologies, AMR is instrumental in helping its clients to make strategic business decisions and achieve sustainable growth in their market domains. We are equipped with skilled analysts and experts, and have a wide experience of working with many Fortune 500 companies and small & medium enterprises.

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